JPH0430691B2 - - Google Patents
Info
- Publication number
- JPH0430691B2 JPH0430691B2 JP60243674A JP24367485A JPH0430691B2 JP H0430691 B2 JPH0430691 B2 JP H0430691B2 JP 60243674 A JP60243674 A JP 60243674A JP 24367485 A JP24367485 A JP 24367485A JP H0430691 B2 JPH0430691 B2 JP H0430691B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- thin film
- cable
- weight
- alloy thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 31
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 24
- 239000002985 plastic film Substances 0.000 claims description 18
- 229920006255 plastic film Polymers 0.000 claims description 18
- 238000005260 corrosion Methods 0.000 description 11
- 230000007797 corrosion Effects 0.000 description 10
- 239000000203 mixture Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910020935 Sn-Sb Inorganic materials 0.000 description 2
- 229910008757 Sn—Sb Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 235000006506 Brasenia schreberi Nutrition 0.000 description 1
- 244000267222 Brasenia schreberi Species 0.000 description 1
- 240000005572 Syzygium cordatum Species 0.000 description 1
- 235000006650 Syzygium cordatum Nutrition 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Conductors (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60243674A JPS62103909A (ja) | 1985-10-30 | 1985-10-30 | ケ−ブル被覆用鉛ラミネ−トテ−プ |
| KR8602587A KR900002983B1 (en) | 1985-04-11 | 1986-04-04 | Lead alloy foil for laminated tape |
| BR8601625A BR8601625A (pt) | 1985-04-11 | 1986-04-10 | Lamina de liga de chumbo e fita laminada compreendendo a mesma para revestimento de cabos |
| CA 506343 CA1280299C (en) | 1985-04-11 | 1986-04-10 | Lead alloy foil and lead laminated tape using the foil, both designedfor covering cables |
| DE8686105013T DE3678044D1 (de) | 1985-04-11 | 1986-04-11 | Folie aus einer bleilegierung und gewalztes band mit dieser folie, beide zur verwendung in kabelmaenteln. |
| EP19860105013 EP0207236B1 (en) | 1985-04-11 | 1986-04-11 | Lead alloy foil and lead laminated tape using the foil, both designed for covering cables |
| CN86102490A CN86102490B (zh) | 1985-04-11 | 1986-04-11 | 覆盖电缆用的铅合金箔和用这种箔做成的铅叠层带 |
| US07/145,648 US4769514A (en) | 1985-04-11 | 1988-01-13 | Lead alloy foil for laminated tape |
| SG34493A SG34493G (en) | 1985-04-11 | 1993-03-29 | Lead alloy foil and lead laminated tape using the foil,both designed for covering cables |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60243674A JPS62103909A (ja) | 1985-10-30 | 1985-10-30 | ケ−ブル被覆用鉛ラミネ−トテ−プ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62103909A JPS62103909A (ja) | 1987-05-14 |
| JPH0430691B2 true JPH0430691B2 (en]) | 1992-05-22 |
Family
ID=17107300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60243674A Granted JPS62103909A (ja) | 1985-04-11 | 1985-10-30 | ケ−ブル被覆用鉛ラミネ−トテ−プ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62103909A (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2748126B2 (ja) * | 1988-08-15 | 1998-05-06 | 日本製箔株式会社 | 鉛合金圧延箔 |
| JP2621470B2 (ja) * | 1989-03-23 | 1997-06-18 | 日立電線株式会社 | シールド層付電線の製造方法 |
| JPH0733479B2 (ja) * | 1989-03-23 | 1995-04-12 | 日立電線株式会社 | 解体容易な電線・ケーブル貫通部 |
| JP2918930B2 (ja) * | 1989-10-24 | 1999-07-12 | 古河電気工業株式会社 | 電気ケーブル用導電性薄葉体の製造方法 |
-
1985
- 1985-10-30 JP JP60243674A patent/JPS62103909A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62103909A (ja) | 1987-05-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |